Lub chaw nres tsheb soldering yuav tsum tau them sai sai rau plaub qhov chaw kub hauv qab no thaum vuam.
① Preheat cheeb tsam (preheat cheeb tsam). Lub hom phiaj ntawm preheating yog ob zaug: ib qho yog los tiv thaiv ib sab ntawm cov ntawv luam tawm los ntawm kev deformed los ntawm tshav kub, thiab lwm yam yog kom ceev lub melting ntawm solder. Rau cov ntawv luam tawm nrog cov cheeb tsam loj, preheating yog qhov tseem ceeb dua. Vim qhov txwv tsis pub muaj cua sov ntawm cov ntawv luam tawm nws tus kheej, qhov kub thiab txias dua, lub sijhawm cua sov yuav tsum luv dua. Cov ntawv luam tawm ib txwm muaj kev nyab xeeb hauv qab 150 degree (tsis ntev dhau). Feem ntau siv 1.5mm tuab me me cov ntawv luam tawm tuaj yeem teeb qhov kub ntawm 150-160 degree thiab lub sijhawm nyob hauv 90 vib nas this. Tom qab lub BGA ntaus ntawv yog unpacked, nws yuav tsum tau siv nyob rau hauv 24 teev. Yog tias lub pob qhib ntxov dhau lawm, txhawm rau tiv thaiv lub cuab yeej los ntawm kev puas tsuaj thaum lub sijhawm ua haujlwm rov ua haujlwm (popcorn effect), nws yuav tsum tau qhuav ua ntej thauj khoom. Lub tshuab ziab khaub ncaws ua ntej yuav tsum yog 100-110 degree, thiab lub sij hawm ua ntej yuav tsum ntev dua.
② Nruab nrab kub cheeb tsam (soak cheeb tsam). Lub preheating kub nyob rau hauv qab ntawm lub board luam ntawv yuav zoo ib yam li los yog me ntsis siab tshaj qhov preheating kub nyob rau hauv lub preheating cheeb tsam. Qhov kub ntawm lub nozzle yog siab tshaj qhov kub nyob rau hauv lub preheating cheeb tsam thiab qis tshaj nyob rau hauv lub kub cheeb tsam. Lub sijhawm feem ntau yog li 60 vib nas this.
③ Qhov kub thiab txias (qhov chaw siab tshaj). Qhov kub ntawm lub nozzle nce mus txog nws qhov siab tshaj plaws hauv cheeb tsam no. Qhov kub yuav tsum siab tshaj qhov melting point ntawm solder, tab sis zoo dua tsis ntau tshaj 200 degree.
Ntxiv nrog rau kev xaiv kom raug cov cua sov thiab lub sijhawm ntawm txhua cheeb tsam, kev saib xyuas yuav tsum tau them rau cov cua sov. Feem ntau, thaum kub qis dua 100 degree, qhov siab tshaj plaws cua sov tsis tshaj 6 degree / s, thiab qhov siab tshaj plaws cua sov tshaj 100 degree tsis tshaj 3 degree / s; nyob rau hauv qhov chaw txias, qhov siab tshaj plaws cua txias tsis tshaj 6 degree / s.
(Ceramic-encapsulated BGA li) thiab PBGA chips (yas-encapsulated BGA li) muaj qee qhov sib txawv ntawm cov kev txwv saum toj no: lub pob kab taub ntawm CBGA cov khoom siv yuav tsum yog li 15 feem pua loj dua li ntawm PBGA li, thiab cov khoom siv ntawm cov khoom siv yog 90Sn / 10Pb, siab dua melting point. Nyob rau hauv txoj kev no, tom qab CBGA ntaus ntawv yog desoldered, cov pob solder yuav tsis lo rau lub board luam ntawv.
Cov nplaum nplaum txuas txuas lub pob ntawm cov khoom siv CBGA rau cov ntawv luam tawm tuaj yeem siv tib lub solder li PBGA ntaus ntawv (qhov muaj pes tsawg leeg yog 63Sn / 37Pb), yog li ntawd tom qab BGA ntaus ntawv raug rub tawm, lub pob solder tseem txuas nrog. tus pin ntaus ntawv thiab yuav tsis ua raws li cov ntawv luam tawm. lub rooj tsavxwm
