Lub luag hauj lwm ntawm Metallographic Microscope nyob rau hauv cov txheej txheem tswj ntawm lub Printed Circuit Board Slicing Technology
Lub luag haujlwm ntawm kev tshuaj xyuas cov khoom hauv kev tsim cov txheej txheem ntau txheej PCB yog tias qhov zoo ntawm tooj liab-clad laminates xav tau rau ntau txheej PCB pawg thawj coj saib yuav cuam tshuam ncaj qha rau kev tsim ntau txheej PCB boards. Cov ntaub ntawv tseem ceeb hauv qab no tuaj yeem tau txais los ntawm cov khoom siv los ntawm metallography:
1.1 Copper foil thickness, xyuas seb cov ntawv ci tooj liab thickness ua tau raws li qhov yuav tsum tau ua ntawm ntau txheej luam ntawv boards.
1.2 Thickness ntawm rwb thaiv tsev txheej thiab kev npaj ntawm semi-kho nplooj ntawv.
1.3 Lub longitudinal thiab latitudinal kev npaj ntawm iav fibers thiab resin ntsiab lus nyob rau hauv lub insulating nruab nrab ntawm Olympus metallographic microscope.
(1) Pinhole
Ib lub qhov me me uas ua tiav nkag mus rau ib txheej ntawm cov hlau. Rau kev tsim cov ntawv luam tawm ntau txheej nrog cov kab hluav taws xob siab, cov kev tsis zoo no feem ntau tsis tso cai.
(2) Pleev thiab dents
Pitting yog hais txog cov qhov me me uas tsis tau nkag mus rau hauv cov ntawv hlau: Concave pits xa mus rau me ntsis protrusions uas yuav tshwm sim nyob rau saum npoo ntawm cov ntawv ci tooj liab tom qab nias, uas tej zaum yuav tshwm sim los ntawm kev siv cov hlau sib tsoo hauv zos thaum lub sij hawm nias. txheej txheem. Lub xub ntiag ntawm qhov tsis xws luag tuaj yeem txiav txim siab los ntawm kev ntsuas qhov loj ntawm lub qhov me me thiab qhov tob ntawm kev tawg los ntawm metallographic slicing.
(3) Kos
Kos yog hais txog cov grooves zoo thiab ntiav kos rau ntawm qhov chaw ntawm cov ntawv ci tooj liab los ntawm cov khoom ntse. Ntsuas qhov dav thiab qhov tob ntawm khawb los ntawm metallographic microscope slicing los txiav txim seb puas muaj qhov tsis xws luag raug tso cai.
(4) Wrinkles thiab folds
Wrinkles yog hais txog cov creases los yog wrinkles nyob rau ntawm tooj liab foil nto ntawm lub phaj siab. Lub xub ntiag ntawm qhov tsis xws luag yog tsis tso cai raws li tuaj yeem pom los ntawm ntu metallographic.
(5) Laminated voids, dawb me ntsis, thiab npuas
Laminated voids xa mus rau thaj chaw uas yuav tsum muaj cov resin thiab nplaum nyob rau hauv lub laminated board, tab sis cov filling tsis tiav thiab muaj cov chaw uas ploj lawm; Cov pob dawb yog qhov tshwm sim uas tshwm sim hauv cov substrate, qhov twg iav fibers cais los ntawm cov resin ntawm qhov sib cuam tshuam ntawm cov ntaub, tshwm sim raws li cov pob dawb tawg los yog "cross qauv" hauv qab ntawm lub substrate; Bubbling yog hais txog qhov tshwm sim ntawm kev nthuav dav hauv zos thiab kev sib cais ntawm cov khaubncaws sab nraud povtseg ntawm cov substrate lossis nruab nrab ntawm cov substrate thiab cov ntawv ci tooj liab. Lub hav zoov ntawm qhov tsis xws luag yog nyob ntawm qhov xwm txheej tshwj xeeb los txiav txim seb lawv puas raug tso cai.
