Lub luag hauj lwm ntawm metallurgical microscopy nyob rau hauv cov txheej txheem tswj ntawm PCB board technology
1. metallurgical microscope nyob rau hauv PCB board slicing technology nyob rau hauv cov txheej txheem tswj lub luag hauj lwm
PCB board ntau lawm, yog ntau yam txheej txheem hauv kev sib koom tes. Qhov zoo ntawm cov khoom ua ntej cov txheej txheem ntawm cov khoom zoo, ncaj qha cuam tshuam rau cov txheej txheem tom ntej ntawm cov khoom tsim, thiab txawm ncaj qha cuam tshuam rau qhov zoo ntawm cov khoom kawg. Yog li ntawd, kev tswj kom zoo ntawm cov txheej txheem tseem ceeb plays lub luag haujlwm tseem ceeb hauv qhov zoo ntawm cov khoom kawg. Raws li ib qho ntawm kev tshawb pom txhais tau tias ntawm metallographic sectioning thev naus laus zis, hauv daim teb no tau ua lub luag haujlwm loj zuj zus.
Metallographic microscope nyob rau hauv PCB board slicing technology nyob rau hauv tus txheej txheem ntawm kev tswj lub luag hauj lwm ntawm uas yog cov nram qab no yam
2.1 Lub luag haujlwm ntawm kev tshuaj xyuas cov khoom raw khoom
Raws li ib tug multilayer PCB board zus tau tej cov tooj liab-clad laminate, nws zoo yuav ncaj qha cuam tshuam rau zus tau tej cov multilayer PCB board. Cov ntaub ntawv tseem ceeb hauv qab no tuaj yeem tau txais los ntawm cov hlais coj los ntawm metallurgical microscope.
2.1.1 Lub thickness ntawm tooj liab ntawv ci, xyuas seb lub thickness ntawm tooj liab ntawv nyiaj raws li qhov yuav tsum tau ntawm ntau txheej luam ntawv Circuit Court boards.
2.1.2 Thickness ntawm dielectric txheej thiab kev npaj ntawm daim ntawv semi-kho.
2.1.3 Rwb thaiv tsev nruab nrab, iav fiber ntau npaj thiab cob cov ntsiab lus nyob rau hauv warp thiab weft kev taw qhia.
2.1.4 Cov ntaub ntawv ntawm laminate defects Qhov tsis xws ntawm laminates feem ntau yog cov hauv qab no.
(1) Pinholes
Qhov no yog hais txog qhov me me uas nkag mus rau hauv ib txheej ntawm hlau. Rau kev tsim cov kab hluav taws xob ntau dua ntawm cov khoom siv hluav taws xob ntau ntau, feem ntau tsis raug tso cai kom pom qhov tsis xws luag.
(2) Qhov chaw thiab qhov chaw
loog yog hais txog cov qhov me me uas tsis nkag mus rau hauv cov ntawv hlau: lub qhov yog hais txog cov txheej txheem nias, tuaj yeem siv los zom cov hlau phaj hauv zos cov ntsiab lus zoo li protrusions, uas ua rau lub siab tom qab qhov chaw ntawm cov ntawv ci tooj liab tau tshwm sim kom yooj yim. phenomenon ntawm kev tawg. Qhov luaj li cas ntawm lub qhov thiab qhov tob ntawm cov khoom tuaj yeem ntsuas los ntawm metallographic seem los txiav txim seb qhov muaj qhov tsis xws luag yog tso cai los yog tsis.
(3) Kos
Kos yog cov grooves ntiav ua los ntawm cov khoom ntse nyob rau saum npoo ntawm cov ntawv ci tooj liab. Qhov dav thiab qhov tob ntawm qhov khawb yog ntsuas los ntawm metallurgical microscope seem los txiav txim seb qhov muaj qhov tsis xws luag yog tso cai los yog tsis.
(4) Wrinkle
Wrinkles yog creases los yog wrinkles nyob rau hauv daim ntawv tooj liab nyob rau saum npoo ntawm platen. Lub hav zoov ntawm qhov tsis xws luag tuaj yeem pom los ntawm metallographic sectioning yog tsis tso cai.
(5) Laminated voids, dawb me ntsis thiab hlwv
Laminated kab noj hniav yog lub laminate yuav tsum muaj resin thiab nplaum, tab sis sau tsis tiav thiab tsis muaj qhov chaw; qhov chaw dawb yog tshwm sim nyob rau hauv lub substrate, nyob rau hauv lub textile interweaving ntawm lub iav fiber thiab resin sib cais tshwm sim, manifested nyob rau hauv lub substrate nyob rau hauv lub nto ntawm dispersed dawb me ntsis los yog "crosses"; blistering yog hais txog lub substrate ntawm interlayer los yog lub substrate thiab conductive nruab nrab ntawm cov khaubncaws sab nraud povtseg ntawm lub substrate los yog substrate thiab conductive tooj liab ntawv ci, uas ua rau lub zos expansion tshwm sim los ntawm lub phenomenon ntawm lub zos sib cais. Lub hav zoov ntawm qhov tsis xws luag, nyob ntawm seb qhov xwm txheej tshwj xeeb los txiav txim seb puas yuav tso cai.
