Daim ntawv thov ntawm Metallurgical Microscopes hauv PCB Production
Lub luag haujlwm ntawm kev tshuaj xyuas cov khoom nkag hauv kev tsim cov ntau- txheej PCB boards yog qhov zoo ntawm tooj liab- clad laminates xav tau rau ntau- txheej PCB board ntau lawm yuav cuam tshuam ncaj qha rau kev tsim khoom ntawm ntau- txheej PCB boards. Cov ntaub ntawv tseem ceeb hauv qab no tuaj yeem tau txais los ntawm cov hlais coj los ntawm lub tshuab ntsuas metallographic:
1.1 Copper foil thickness, xyuas seb lub thickness ntawm tooj liab ua tau raws li qhov yuav tsum tau ua ntawm ntau- txheej luam ntawv boards.
1.2 Thickness ntawm rwb thaiv tsev txheej thiab kev npaj ntawm semi-kho los xij.
1.3 Lub longitudinal thiab latitudinal kev npaj ntawm iav fibers thiab resin ntsiab lus nyob rau hauv insulating xov xwm.
1.4 Metallographic microscope laminated phaj defect cov ntaub ntawv: Lub ntsiab tsis xws luag ntawm laminated phaj yog raws li nram no:
(1) Pinhole yog hais txog lub qhov me me uas nkag mus rau hauv ib txheej ntawm hlau. Rau kev tsim khoom ntawm ntau- txheej luam ntawv boards uas muaj cov kab hluav taws xob siab, cov kev tsis zoo no feem ntau tsis tso cai.
(2) Pitts thiab dents hais txog qhov me me uas tsis tau nkag mus rau hauv cov ntawv hlau: dents hais txog me me protrusions uas yuav tshwm sim nyob rau hauv qee qhov ntawm cov hlau phaj siv rau kev nias thaum lub sij hawm nias, ua rau ib tug maj mam sinking tshwm sim nyob rau hauv tooj liab ntawv ci nto tom qab nias. Lub xub ntiag ntawm qhov tsis xws luag tuaj yeem txiav txim siab los ntawm kev ntsuas qhov loj ntawm lub qhov me me thiab qhov tob ntawm kev tawg los ntawm metallographic slicing.
(3) Cov khawb yog hais txog cov grooves zoo thiab ntiav uas tau kos rau ntawm daim ntawv tooj liab los ntawm cov khoom ntse. Ntsuas qhov dav thiab qhov tob ntawm khawb los ntawm metallographic microscope slicing los txiav txim seb puas muaj qhov tsis xws luag raug tso cai.
(4) Wrinkles thiab folds hais txog cov creases los yog wrinkles ntawm cov ntawv ci tooj liab ntawm lub phaj siab. Lub xub ntiag ntawm qhov tsis xws luag yog tsis tso cai raws li tuaj yeem pom los ntawm ntu metallographic.
(5) Laminated voids, dawb me ntsis, thiab npuas xa mus rau qhov chaw uas yuav tsum muaj resin thiab nplaum nyob rau hauv lub laminated board, tab sis lub filling yog tsis tiav thiab tsis muaj; Cov pob dawb yog qhov tshwm sim uas tshwm sim hauv cov substrate, qhov twg iav fibers cais los ntawm cov resin ntawm qhov sib cuam tshuam ntawm cov ntaub, tshwm sim raws li cov pob dawb tawg los yog "cross qauv" hauv qab ntawm lub substrate; Bubbling yog hais txog qhov tshwm sim ntawm kev nthuav dav hauv zos thiab kev sib cais ntawm cov khaubncaws sab nraud povtseg ntawm cov substrate lossis nruab nrab ntawm cov substrate thiab cov ntawv ci tooj liab. Lub hav zoov ntawm qhov tsis xws luag yog nyob ntawm qhov xwm txheej tshwj xeeb los txiav txim seb lawv puas raug tso cai.
