Lub luag haujlwm ntawm metallographic microscope hauv kev tswj cov txheej txheem ntawm PCB board slicing technology
Raws li tooj liab-clad laminate yuav tsum tau rau zus tau tej cov multilayer PCBs, nws zoo yuav ncaj qha cuam tshuam rau zus tau tej cov multilayer PCBs. Cov ntaub ntawv tseem ceeb hauv qab no tuaj yeem tau txais los ntawm cov hlais coj los ntawm metallography:
1.3 Nyob rau hauv nruab nrab insulating, lub warp thiab weft npaj ntawm iav fibers thiab cov ntsiab lus resin.
Pockmarks hais txog cov qhov me me uas tsis nkag mus rau hauv cov ntawv hlau: cov pits xa mus rau qhov taw tes-puab protrusions uas tej zaum yuav yog ib feem ntawm cov hlau phaj pressed siv thaum lub sij hawm nias, uas ua rau ib tug intensified sinking scene ntawm nias tooj liab ntawv ci nto. Qhov luaj li cas ntawm lub qhov me me thiab qhov tob ntawm qhov tawg tuaj yeem ntsuas los ntawm metallographic slices los txiav txim siab seb qhov muaj nyob ntawm qhov tsis xws luag puas tau.
1.2 Lub thickness ntawm insulating nruab nrab txheej thiab txheej txheem ntawm prepreg.
1.1 Copper foil thickness, xyuas seb cov ntawv ci tooj liab thickness ua tau raws li qhov yuav tsum tau ua ntawm ntau cov ntawv luam tawm.
Kos yog hais txog nyias thiab ntiav grooves kos rau saum npoo ntawm cov ntawv ci tooj liab los ntawm cov khoom ntse. Los ntawm kev ntsuas ntawm qhov dav thiab qhov tob ntawm qhov khawb ntawm qhov chaw metallographic microscope, nws tau txiav txim siab seb qhov muaj qhov tsis xws luag puas tau.
Hais txog lub qhov me me uas nkag mus rau hauv ib txheej ntawm hlau. Rau cov ntawv luam tawm ntau yam uas muaj cov kab hluav taws xob ntau dua, qhov tsis txaus no feem ntau tsis tso cai.
Wrinkles yog creases los yog wrinkles nyob rau hauv daim ntawv tooj liab nyob rau saum npoo ntawm platen. Nws tuaj yeem pom los ntawm seem metallographic tias qhov muaj nyob ntawm qhov tsis xws luag yog tsis tso cai.
Lamination voids xa mus rau thaj chaw uas yuav tsum muaj cov resin thiab nplaum rau sab nraud ntawm lub laminate, tab sis cov filling tsis tiav thiab muaj cov chaw uas ploj lawm; dawb me ntsis tshwm sim sab nraum lub substrate, thiab cov iav fiber ntau thiab resin yog sib cais ntawm kev sib tshuam ntawm cov ntaub. tawg pob zeb dawb los yog "cross qauv" tshwm nyob rau hauv qab ntawm lub substrate; blistering yog hais txog qhov tshwm sim ntawm ib nrab shrinkage ntawm cov khaubncaws sab nraud povtseg ntawm lub substrate los yog nruab nrab ntawm lub substrate thiab conductive tooj liab ntawv ci, ua rau ib feem ntawm kev sib cais. Qhov muaj qhov tsis xws luag yog nyob ntawm qhov xwm txheej tshwj xeeb los txiav txim siab seb puas yuav tso cai.
