Lub luag hauj lwm ntawm metallographic microscope nyob rau hauv cov txheej txheem tswj ntawm PCB board technology
1. Lub luag haujlwm ntawm metallographic microscope hauv PCB board slicing tshuab hauv kev tswj cov txheej txheem
Kev tsim cov PCB boards yog txheej txheem uas muaj ntau yam txheej txheem sib koom ua ke. Qhov zoo ntawm cov khoom hauv cov txheej txheem dhau los ncaj qha cuam tshuam rau kev tsim cov txheej txheem tom ntej, thiab txawm tias ncaj qha cuam tshuam rau qhov zoo ntawm cov khoom kawg. Yog li ntawd, kev tswj kom zoo ntawm cov txheej txheem tseem ceeb plays lub luag haujlwm tseem ceeb hauv qhov zoo ntawm cov khoom kawg. Raws li ib qho ntawm cov kev tshawb pom, metallographic sectioning technology plays lub luag haujlwm tseem ceeb hauv daim teb no.
Lub luag hauj lwm ntawm metallographic microscope nyob rau hauv cov txheej txheem tswj ntawm PCB board slicing technology muaj xws li cov nram qab no yam:
2.1 Lub luag haujlwm hauv kev tshuaj xyuas cov khoom siv raw
Raws li tooj liab-clad laminate xav tau rau kev tsim ntau txheej PCB boards, nws qhov zoo yuav cuam tshuam ncaj qha rau kev tsim ntau txheej PCB boards. Cov ntaub ntawv tseem ceeb hauv qab no tuaj yeem tau txais los ntawm cov khoom siv nrog lub tshuab ntsuas metallographic:
2.1.1 Copper foil thickness, xyuas seb cov ntawv ci tooj liab thickness ua tau raws li qhov yuav tsum tau ua ntawm ntau txheej luam ntawv boards.
2.1.2 Thickness ntawm insulating dielectric txheej thiab kev npaj ntawm prepreg ntawv.
2.1.3 Nyob rau hauv nruab nrab insulating, lub warp thiab weft npaj ntawm iav fibers thiab cov ntsiab lus resin.
2.1.4 Laminated board defect cov ntaub ntawv Laminated board defects feem ntau suav nrog cov hauv qab no:
(1) Pinhole
Hais txog lub qhov me me uas nkag mus rau hauv ib txheej ntawm hlau. Rau kev tsim cov ntawv luam tawm ntau txheej nrog cov kab hluav taws xob ntau dua, qhov kev tsis zoo no feem ntau tsis tso cai rau tshwm sim.
(2) Pockmarks thiab dents
Pitting yog hais txog qhov me me uas tsis tau nkag mus rau hauv cov ntawv hlau; pits xa mus rau lub zos dot-zoo li protrusions ntawm pressed steel phaj siv thaum lub sij hawm nias txheej txheem, ua rau maj mam txo qis rau ntawm qhov chaw ntawm cov ntawv xovxwm tooj liab. Qhov luaj li cas ntawm lub qhov thiab qhov tob ntawm qhov chaw tuaj yeem ntsuas los ntawm metallographic seem los txiav txim seb puas muaj qhov tsis xws luag yog tso cai.
(3) Kos
Kos yog hais txog nyias thiab ntiav grooves khawb ntawm qhov chaw ntawm tooj liab ntawv ci los ntawm cov khoom ntse. Ntsuas qhov khawb qhov dav thiab qhov tob los ntawm metallographic microscope seem los txiav txim seb puas muaj qhov tsis xws luag raug tso cai.
(4) Wrinkles
Wrinkles yog hais txog cov creases los yog wrinkles nyob rau hauv daim ntawv tooj liab nyob rau saum npoo ntawm lub phaj siab. Lub hav zoov ntawm qhov tsis xws luag tuaj yeem pom los ntawm metallographic sectioning thiab tsis tso cai.
(5) Lamination voids, dawb me ntsis thiab hlwv
Laminated voids xa mus rau thaj chaw uas yuav tsum muaj resin thiab nplaum nyob rau hauv lub laminate, tab sis tsis tiav puv thiab ploj lawm; cov pob dawb tshwm sim hauv cov khoom siv hauv paus, qhov twg cov iav fiber ntau thiab cov resin sib cais ntawm qhov kev sib tshuam ntawm cov ntaub, uas yog manifested li Scattered dawb me ntsis los yog "cross qauv" tshwm nyob rau hauv lub nto ntawm lub substrate; blistering yog hais txog qhov tshwm sim ntawm kev nthuav dav hauv zos thiab kev sib cais hauv zos ntawm cov txheej txheem ntawm cov substrate lossis nruab nrab ntawm cov substrate thiab cov ntawv ci tooj liab. Qhov tshwm sim ntawm qhov tsis xws luag yuav raug txiav txim siab nyob ntawm qhov xwm txheej tshwj xeeb.
