Daim ntawv thov ntawm tag nrho cov theem microscope nyob rau hauv zus tau tej cov printed circuit boards
Lub luag hauj lwm hauv kev tshuaj xyuas cov khoom raw khoom Raws li tooj liab-clad laminate xav tau rau kev tsim cov multilayer PCB boards, nws qhov zoo yuav muaj kev cuam tshuam ncaj qha rau kev tsim cov multilayer PCB boards. Los ntawm metallurgical microscope, cov ntaub ntawv tseem ceeb hauv qab no tuaj yeem tau txais los ntawm cov hlais noj.
1.1 Thickness ntawm tooj liab ntawv ci, los xyuas seb lub thickness ntawm tooj liab ntawv ua tau raws li qhov yuav tsum tau ntau lawm ntawm multilayer luam Circuit Court boards.
1.2 Lub thickness ntawm dielectric txheej thiab kev npaj ntawm daim ntawv semi-kho.
1.3 Kev npaj ntawm cov iav fibers nyob rau hauv qhov nruab nrab rwb thaiv tsev nyob rau hauv warp thiab weft cov lus qhia thiab cov ntsiab lus resin.
1.4 Metallographic microscopy laminate defects cov ntaub ntawv Laminate defects feem ntau yog cov hauv qab no.
(1) pinhole yog hais txog lub qhov me me uas nkag mus rau hauv ib txheej ntawm hlau. Rau kev tsim cov kab hluav taws xob ntau dua ntawm cov ntawv luam tawm multilayer, feem ntau tsis tso cai kom pom qhov tsis xws luag.
(2) pitting thiab pits pitting yog hais txog cov qhov me me uas tsis nkag mus rau hauv cov ntawv hlau: cov pits hais txog cov txheej txheem nias, yuav raug siv los zom cov hlau phaj hauv zos zoo li protrusions, uas ua rau lub siab tom qab ntawm cov tooj liab. ntawv ci tshwm sim tom qab ib tug maj sagging phenomenon. Nws tuaj yeem ntsuas los ntawm metallographic seem ntawm qhov loj ntawm lub qhov thiab qhov tob ntawm kev tawg, txhawm rau txiav txim siab seb qhov muaj nyob ntawm qhov tsis zoo yog tso cai.
(3) Cov cim kos yog cov grooves ntiav ua los ntawm cov khoom ntse ntawm cov ntawv ci tooj liab. Qhov dav thiab qhov tob ntawm khawb yog ntsuas los ntawm metallographic microscope seem los txiav txim seb qhov muaj qhov tsis xws luag yog tso cai los yog tsis.
(4) Folds Folds yog creases los yog wrinkles nyob rau hauv daim ntawv tooj liab nyob rau saum npoo ntawm platen. Lub hav zoov ntawm qhov tsis xws luag tuaj yeem pom los ntawm ntu metallographic tsis raug tso cai.
(5) laminated hollow, dawb me ntsis thiab blistering laminated hollow hais txog lub laminate yuav tsum muaj resin thiab nplaum, tab sis sau tsis tiav thiab tsis muaj qhov chaw; dawb me ntsis tshwm sim nyob rau hauv lub substrate, nyob rau hauv lub textile fabrics ntawm kev sib cais ntawm iav fibers thiab resin phenomenon, manifested nyob rau hauv lub substrate nyob rau hauv lub nto ntawm dispersed dawb me ntsis los yog "cross-hatched"; blistering Hais txog lub substrate ntawm cov txheej los yog substrate thiab conductive tooj liab ntawv ci, uas ua rau lub zos expansion tshwm sim los ntawm lub zos sib cais ntawm phenomenon. Lub hav zoov ntawm qhov tsis xws luag, nyob ntawm seb qhov xwm txheej tshwj xeeb los txiav txim seb puas yuav tso cai.
